This is a state of the art digital microscope from Keyence. This is a useful machine for getting quick metrology results using both laser and optics to check the building accuracy of components assembled in the facility.
OGP SMARTSCOPE FLASH 500 SOFTWARE
The machine is fully programmable with a program once and then repeat function.Īll measurement outputs can be saved and dimensions can either be calculated using the machine interface and then exported for use in other software packages. The X, Y and Z measurments has an accuracy resolution of 0.5 microns.
The working area is (X)500 mm by (Y) 450 mm. This is a high precision metrology machine which includes the additional Digital Range Sensor laser probe. This is our main wire bonder and is used for all the important wire-bonding jobs, and is particularly vital for large volume production work. Link to the Hesse & Knipps BJ820 webpage. It features a realtime bond quality monitoring system. It has a bonding area of 305 mm x 410 mm with a production bonding speed of up to 7 wires per second with a bonding position accuracy of 1 micron. Loops lengths can be from 70 microns up to 20 mm with programable wire lengths, loop heights and individual loop shapes. Wire bonding layout programs can be created which can then be saved and used for future wire bonding operations.
This is a high speed automatic fine wire wedge bonder currently configured for 25 micron aluminium wire.Īutomatic pattern recognition to aid location of bonding pads allows for fully automatic operation. We have two Hesse & Knipps BondJet 820 automatic wire bonders to allow high volume production alongside R&D work. Hesse & Knipps BondJet 820 automatic wire bonder An ALiBaVa readout system is available for characterization silicon detectors.īelow you will find a description of the equipment that is used in the facility. Testing of electronics, sensors and detector modules is carried out with radioactive sources and TCT measurements in the lab, and with protons irradiations at the MC40. Our main expertise is in providing high-density interconnects and precision assembly of semiconductor based detector systems (application specific read-out chips with wafer-scale sensors) for Particle Physics experiments. Exact positional information is output to the metrology software at selectable data rates and spacing intervals.The BILPA laboratory area consists of an ISO-14644-1 Class-5 and Class-7 clean room for semiconductor detector system assembly and testing. Scattered light is collected by a sensor array. The surface is illuminated with a small laser spot. The DRS Laser uses laser triangulation to determine surface heights. This version can work better on transparent or white parts. There is a special version of the DRS-500 (DRS 500B) that uses a blue laser rather than a red laser. Both models have the same 17 mm working distance and are mounted in mechanical deployment mechanisms so they can be retracted when not in use. Two DRS laser probes are available, each with its own spot size. Both linear and area scans are easily programmed into automatic measurement routines for accurate measurement of surface contours. A DRS™ (Digital Range Sensor) Laser Probe on SprintMVP’s and select SmartScope systems provides non-contact, high resolution surface contouring to supplement video measurements.Īs one of the sensors supported by OGP multisensor measurement systems, the metrology software integrates DRS laser data points as easily as those gathered by video measurement.
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